Method of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cells

ABSTRACT

A semiconductor memory device includes, a) a semiconductor substrate; b) a field effect transistor gate positioned outwardly of the semiconductor substrate; c) opposing active areas formed within the semiconductor substrate on opposing sides of the gate; d) a capacitor electrically connected with one of the active areas; the capacitor comprising an inner storage node, a capacitor dielectric layer, and an outer cell node; the inner storage node electrically connecting with the one active area, the inner storage node having an upper surface at an elevation; e) a bit line; f) a dielectric insulating layer positioned intermediate the bit line and the other active area; and g) an electrically conductive bit line plug extending through the insulating layer to contact with the other active area and electrically interconnect the bit line with the other active area, the bit line plug being homogeneous in composition between the other active area and the elevation of the inner storage node upper surface. A method of producing such a construction is also disclosed.

RELATED PATENT DATA

This patent resulted from a continuation of U.S. Pat. application Ser.No. 08/712,616, now U.S. Pat. No. 5,702,990, filed on Sep. 13, 1996,entitled "Method of Forming a Bit Line Over Capacitor Array of MemoryCells and an Array of Bit Line Over Capacitor Array of Memory Cells",listing Mark Jost and Charles H. Dennison as inventors, which is acontinuation of U.S. Pat. application Ser. No. 08/394,546, now U.S. Pat.No. 5,605,857, filed on Feb. 22, 1995, entitled "Method of Forming a BitLine Over Capacitor Array of Memory Cells and an Array of Bit Line OverCapacitor Array of Memory Cells", listing Mark Jost and Charles H.Dennison as inventors; which is a continuation-in-part patentapplication of U.S. Pat. application Ser. No. 08/277,916, filed on Jul.20, 1994, entitled "Method Of Forming A Bit Line Over Capacitor Array OfMemory Cells", listing Charles H. Dennison as an inventor, and which isnow U.S. Pat. No. 5,401,681; which is a continuation-in-part of Ser. No.47,668, Apr. 14, 1993, Pat. No. 5,338,700; and a continuation-in-part ofSer. No. 17,067, Feb. 12, 1993, Pat. No. 5,340,763.

TECHNICAL FIELD

This invention relates generally to formation of a bit line overcapacitor arrays of memory cells.

BACKGROUND OF THE INVENTION

As DRAMs increase in memory cell density, there is a continuingchallenge to maintain sufficiently high storage capacitance despitedecreasing cell area. Additionally, there is a continuing goal tofurther decrease cell area. The principal way of increasing cellcapacitance is through cell structure techniques. Such techniquesinclude three-dimensional cell capacitors, such as trenched or stackedcapacitors.

Conventional stacked capacitor DRAM arrays utilize either a buried bitline or a non-buried bit line construction. With buried bit lineconstructions, bit lines are provided in close vertical proximity to thebit line contacts of the memory cell field effect transistors (FETs),with the cell capacitors being formed horizontally over the top of theword lines and bit lines. With non-buried bit line constructions, deepvertical contacts are made through a thick insulating layer to the cellFETs, with the capacitor constructions being provided over the wordlines and beneath the bit lines. Such non-buried bit line constructionsare also referred to as "capacitor-under-bit line" or "bitline-over-capacitor" constructions, and are the subject of thisinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is a diagrammatic sectional view of a semiconductor waferfragment at one processing step in accordance with the invention.

FIG. 2 is a view of the FIG. 1 wafer taken at a step subsequent to thatshown by FIG. 1.

FIG. 3 is a view of the FIG. 1 wafer taken at a step subsequent to thatshown by FIG. 2.

FIG. 4 is a view of the FIG. 1 wafer taken at a step subsequent to thatshown by FIG. 3.

FIG. 5 is a view of the FIG. 1 wafer taken at a step subsequent to thatshown by FIG. 4.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of theconstitutional purposes of the U.S. Patent Laws "to promote the progressof science and useful arts" (Article 1, Section 8).

In accordance with one aspect of the invention, a method of forming abit line over capacitor array of memory cells comprises the followingsteps:

providing an array of substantially electrically isolated word linesatop a semiconductor wafer;

providing active areas about the word lines to define an array of memorycell FETs, the active areas being defined by a first active region forelectrical connection with a memory cell capacitor and a second activeregion for electrical connection with a bit line;

providing a layer of electrically insulating material over the wordlines and active areas, the layer of insulating material having anuppermost surface which is above the word lines;

providing a second contact opening through the insulating material layerto the second active region;

providing a first electrically conductive layer over the insulatingmaterial upper surface and within the second contact opening whichelectrically connects with the second active region, the firstelectrically conductive layer being provided to a thickness whichcompletely fills the second contact opening;

providing a first contact opening through the first electricallyconductive layer and through the insulating material to the first activeregion;

providing a capacitor storage node electrically conductive layer overthe first electrically conductive layer and within the first contactopening which electrically connects with the first active region, thestorage node layer being provided to a thickness which less thancompletely fills the first contact opening; and

chemical-mechanical polishing the capacitor storage node layer and thefirst conductive layer inwardly to at least the upper surface of theinsulating material, the chemical-mechanical polishing step effectivelyelectrically isolating the first conductive layer material within thesecond contact opening from the storage node conductive layer materialwithin the first contact opening, the chemical-mechanical polishing stepeffectively defining a homogeneous second contact plug having a plugupper surface, the chemical-mechanical polishing step effectivelydefining an isolated capacitor storage node having an upper surface, theupper surfaces of the plug and storage node being elevationallycoincident.

In accordance with another aspect of the invention, a semiconductormemory device comprises:

a semiconductor substrate;

a field effect transistor gate positioned outwardly of the semiconductorsubstrate;

opposing active areas formed within the semiconductor substrate onopposing sides of the gate;

a capacitor electrically connected with one of the active areas; thecapacitor comprising an inner storage node, a capacitor dielectriclayer, and an outer cell node; the inner storage node electricallyconnecting with the one active area, the inner storage node having anuppermost surface at an elevation;

a bit line;

a dielectric insulating layer positioned intermediate the bit line andthe other active area; and

an electrically conductive bit line plug extending through theinsulating layer to contact with the other active area and electricallyinterconnect the bit line with the other active area, the bit line plugbeing homogeneous in composition between the other active area and theelevation of the inner storage node upper surface.

These and other aspects of the invention will be appreciated from thefollowing description and concluding claims.

Referring first to FIG. 1, a semiconductor wafer fragment is indicatedgenerally by reference numeral 10. Wafer 10 is defined in part by a bulksilicon semiconductive substrate 11, and has been provided with an arrayof substantially electrically isolated word lines, such as theillustrated word lines 12, 14 and 16. Such word lines are of aconventional construction having a lowermost gate oxide, a lowerpolysilicon layer, an overlying silicide layer such as tungstensilicide, and insulating caps and side insulating spacers 18. Suchspacers and caps 18 preferably comprise an insulative nitride, such asSi₃ N₄. A thin layer 20 of Si₃ N₄ is provided atop the wafer to functionas a diffusion barrier. Layer 20 has a thickness which is preferablyfrom about 100 Angstroms to about 250 Angstroms.

Active areas are provided about the word lines, such as active regions22, 24 and 26, to define an array of memory cell FETs. The discussionproceeds with reference to a FET formed using word line 14, which wouldbe provided with a capacitor construction for definition of a singlememory cell. Active region 26 defines a first active region forelectrical connection with a memory cell capacitor (described below).Active region 24 defines a second active region for electricalconnection with a bit line (described below). Field oxide 19 isprovided, as shown.

A planarized first insulating material layer 28 is provided over theword lines and active areas. An example material is borophosphosilicateglass (BPSG). An example deposition thickness is between 6,000 and 9,000Angstroms, with subsequent planarization by chemical-mecbanicalpolishing (CMP) to an elevation of from about 2,000 Angstroms to about4,000 Angstroms above the word line nitride caps 18 which are positionedadjacent the active areas, as opposed to the word lines which are overthe field oxide. Such provides a planarized upper surface 30 which iselevationally above the word lines.

Referring to FIG. 2, a series of contact openings 34 (only one beingshown, and referred to as a second contact opening for purposes of thecontinuing discussion) is provided through insulating material layer 28inwardly to outwardly expose second active region 24. Such wouldtypically be formed by photomasking and dry chemical etching of BPSGselectively relative to nitride. An example etch chemistry would includeCHF₃ and O₂ at low O₂ flow rate (i.e., less than 5% O₂ by volume in aCHF₃ /O₂ mixture), or the combination of CF₄, Ar, CH₂ F₂ and CHF₃.Thereafter, etches of the wafer are conducted to etch nitride layer 20selectively relative to underlying silicon substrate 11 to upwardlyexpose active region 24. An example etch chemistry would include acombination of CHF₃ and CF₄. The principal purpose of barrier layer 20is to prevent diffusion of boron or phosphorus atoms from BPSG layer 28into active areas 24 and 26. Caps 18 are preferably comprised of nitride(Si₃ N₄) and layer 28 comprised of oxide, such that the contact etch toproduce first contact 34 will stop relative to word line spacers andcaps 18.

Subsequently, a first electrically conductive layer 36 is provided overinsulating material layer 28, upper surface 30 and within second contactopening 34 to electrically connect with second active region 24.Conductive layer 36 is deposited to a thickness sufficient to completelyfill second contact opening 34, as shown. An example preferredcomposition is conductively doped polysilicon.

Referring to FIG. 3, a series of first contact openings 32 is providedthrough electrically conductive layer 36 and insulating material layer28 inwardly to outwardly expose first active region 26. Subsequently, acapacitor storage node electrically conductive layer 38 is provided overfirst electrically conductive layer 36 and within first contact opening32 to electrically connect with first active region 26. Layer 38 isdeposited to a thickness which less than completely fills first contactopening 32. An example diameter for first contact opening 32 is 0.5micron by 0.8 micron, while an example diameter for second contactopening 34 is 0.5 micron. In such instance, an example preferredthickness for layer 36 is 4000 Angstroms. An example and preferredmaterial for layer 38 is hemispherical grain (HSG) polysilicon. Such canbe provided by first depositing a 600 Angstroms thick in situ dopedpolysilicon layer, followed by deposition of undoped HSG poly.Subsequent heating inherent in wafer processing will effectivelyconductively dope the overlying HSG poly layer. Alternately, layer 38can be provided by in situ arsenic doping of an entire HSG layer. Layer38 is provided to physically contact active area 26 without there beingany intervening conductive layer.

Referring to FIG. 4, capacitor storage node layer 38 and firstconductive layer 36 are chemically mechanically polished inwardly to atleast upper surface 30 (not shown in FIG. 4) of insulating materiallayer 28. In the illustrated and preferred embodiment, suchchemical-mechanical polishing removes first conductive layer 36 andcapacitor storage node layer 38 downwardly to below former upper surface30 of insulating material 28, which is newly designated with numeral 31.In the illustrated embodiment, such polishing is conducted to removesuch materials to downwardly below the former upper surface ofinsulating material, which is now designated with numeral 31.Preferably, the chemical-mechanical polishing is conducted in a singlestep. An example and preferred chemical-mechanical polishing step toachieve the FIG. 4 construction includes using slurry SC25 from RodelProducts Corporation of Newark, Del., diluted with H₂ O and KOH. SC25consists primarily of H₂ O, silica (SiO₂ particles), and KOH. It isdiluted approximately 1:1 with H₂ O and additional KOH can be injectedat the point of use to increase the pH and adjust the oxide to siliconetch rate if desired.

The chemical-mechanical polishing step effectively electrically isolatesfirst conductive layer material 36 within second contact opening 34 fromstorage node conductive layer material 38 within first contact opening32. The chemical-mechanical polishing step also effectively defines ahomogenous second contact plug 45 having a plug upper surface 49. Also,the chemical-mechanical polishing step effectively defines an isolatedcapacitor storage node 47 having an upper surface 48, with upper surface48 of the storage node being elevationally coincident with upper surface49 of plug 45, and correspondingly with upper surface 31 of insulatingmaterial layer 28.

Referring to FIG. 5, subsequent processing would be conducted inaccordance with that of the parent 08/277,916 disclosure to produce aconstruction corresponding to that of the parent FIG. 7. Specifically,an ONO cell dielectric layer 40 and overlying outer cell polysiliconlayer 42 would be provided as shown to provide a capacitor construction44. An overlying insulating layer 46 would be provided, followed bysubsequent deposition and patterning of a conductive material to form abit line 55. An homogenous electrically conductive bit line plug isthereby provided between active area 24 and the elevation of planarizedsurface 31, and therefore the elevation of inner storage node 47 uppersurface 48.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

We claim:
 1. A method of forming a bit line plug to an active region,comprising the following steps:forming a word line over a semiconductorwafer; forming a first active region and a second active regionassociated with the word line; forming a layer of electricallyinsulating material over the word line and active regions; forming a bitline contact opening through the insulating material layer to the secondactive region; forming an electrically conductive layer over theinsulating material layer and within the bit line contact opening, theelectrically conductive layer within the bit line contact openingultimately forming a bit line plug; and using a single photomaskingstep, removing portions of the electrically conductive layer and theinsulating material to form a capacitor opening to the first activeregion.
 2. A method of forming an array of bit line plugs, comprisingthe following steps:forming an array of word lines over a semiconductorwafer; forming first and second active regions associated with each ofthe word lines; forming a layer of electrically insulating material overthe word lines and active regions; forming bit line contact openingsthrough the insulating material layer to the second active regions;forming an electrically conductive layer over the insulating materiallayer and within the bit line contact openings, the electricallyconductive layer within the bit line contact openings ultimately formingbit line plugs; and using a single photomasking step, removing portionsof the electrically conductive layer and the insulating material to formcapacitor openings to the first active regions.
 3. A method of forming abit line p lug to an active region, comprising the followingsteps:forming a word line over a semiconductor wafer; forming a firstactive region and a second active region associated with the word line;forming a layer of electrically insulating material over the word lineand active regions, the layer of electrically insulating materialcomprising an upper surface at a first level, the layer of electricallyinsulating material comprising borophosphosilicate glass; forming a bitline contact opening through the insulating material layer to the secondactive region; forming an electrically conductive layer over theinsulating material layer and within the bit line contact opening, theelectrically conductive layer within the bit line contact openingultimately forming a bit line plug; forming a capacitor opening throughthe electrically conductive layer and through the insulating material tothe first active region; and after forming the capacitor opening,chemical-mechanical polishing the electrically conductive layer to belowthe first level of the upper surface of the layer of the insulatingmaterial.